Zero Customer Claim in SMT PCB Assembly at Bigmate Philippines

Zero customer claim in SMT PCB assembly ensures defect-free PCBs with no complaints or returns. Strict quality control and process optimization prevent defects, reducing costs and improving customer satisfaction.

Table of Contents

Importance of Zero customer Claim in PCB Assembly

How It Affects Product Reliability

Zero claim in PCB assembly ensures that products work flawlessly, lowering failure rates in critical applications such as consumer electronics, automotive, and medical devices. Eliminating defects improves product durability, safety, and long-term performance.

Cost Savings from Reduced Defects and Returns

Detecting and correcting defects during production is much less expensive than dealing with returns, repairs, or recalls. Zero claim reduces warranty costs, production downtime, and material waste, resulting in improved financial efficiency.

Improved Brand Reputation

Consistent delivery of high-quality, defect-free products fosters customer trust and improves a company’s brand reputation. Companies with zero defects stand out in competitive markets, attracting more business.

Our Quality Control steps when defects are detected

Employee testing a PCB for functionality.

1. Initial Containment & Inspection

  • Shutdown production to prevent further defective units.
  • Contain all work-in-progress (WIP) and finished goods.
  • Perform sorting of affected lots to check for similar defects.

2. Awareness & Root Cause Analysis

  • Inform team members about the defect for better vigilance.
  • Conduct detailed investigations into soldering and assembly processes.
  • Inspect LED components and connectors under a microscope.

3. Defect Simulation & Testing

  • Simulate possible failure scenarios (floating connector, pad delamination).
  • Assess solder joint integrity under stress conditions.
  • Analyze if defects align with real-world production conditions.

4. Quality Measures on Key Processes

  • Soldering Process:
    • Regular temperature checks (340 ±10°C) to ensure proper soldering.
    • Monitor for flux issues, overheating, or solder dewetting.
  • In-Circuit Testing (ICT):
    • Automated process to check circuit integrity and detect solder peeling.
    • Ensures all components meet electrical specifications.
  • Function Testing (FCT):
    • Ensures LEDs emit the correct light and function properly.
    • Detects non-conforming units before final approval.
  • Stamping & Cutting Process:
    • Ensures no damage to solder joints due to handling.
    • Components are secured before final mounting and assembly.
  • Final Visual Inspection (FVI):
    • Checks for any physical damage on mounted components.
    • Ensures no solder peeling or defects due to mechanical stress.

5. Conclusion & Verification

  • Cross-check findings with machine logs (ICT & FCT records).
  • Confirm no defects were present in production.
  • Determine if defects were caused by external handling post-production.

Real-Life Scenario: Addressing a Suspected Defect Before a Claim Is Filed

PCB Visual Inspection - BigmatePH

1. Initial Inspection

  • Visual Inspection: Checked for visible defects (shorted components, damaged PCB, poor soldering).
  • Result: No visible defects found.

2. Functional Circuit Testing (FCT)

  • Tested NG sample from BIPH:
    • Result: The FCT machine detected a defect consistently over five tests, confirming a malfunction.
    • Analysis: Abnormal voltage flow detected, pointing to an internal component failure.

3. Defect Simulation

  • Simulated short circuit at CN1 location:
    • Result: FCT machine confirmed the defect.
  • Simulated short circuit at D1 (Photo Interrupter) location:
    • Result: FCT machine again detected the defect.

4. Data Review & Analysis

  • Reviewed October FCT logs:
    • Result: No similar errors (NG050) found, indicating the defect did not originate during assembly at Bigmate.
  • BIPH Sample Testing:
    • Result: The defect was detected in BIPH’s sample, confirming it likely occurred after leaving Bigmate’s assembly line.

5. Conclusion

  • Findings suggest a component failure occurred after delivery.
  • No historical evidence of this issue in prior production logs.
  • The short circuit likely developed due to external factors post-production.
  • Customer’s claim of a manufacturing defect is invalid.

References:

GreatPCB. (n.d.). Achieving zero defects: Quality control in PCB manufacturing. Retrieved from https://greatpcb.com/achieving-zero-defects-quality-control-in-pcb-manufacturing/

IdeasPCB. (n.d.). How to achieve zero defect in SMT production process? Retrieved from https://www.ideaspcb.com/info/how-to-achieve-zero-defect-in-smt-production-p-77889978.html

For Inquires, Contact the Following:

k-machida@bigmateph.com
m-floro@bigmateph.com
ma-arayata@bigmateph.com
hm-malabuyoc@bigmateph.com
r-nillo@bigmateph.com

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